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Component Capabilities

Component Capabilities

2018-04-28

- Solder Paste Printing

- SMT (BGA, uBGA, PoP and 01005)

- BGA/CSP/CBGA/CCGA/PGA Down To 140 Micron Pitch

- Soldering & Flip Chip with Die Size of 0.5~50mm

- COB/COG/FOG/PoP

- Multi-Chip, Chip On FPC



   
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Notes: 3CEMS PRIME is an Electronic Contract Manufacturer, we only produce your designed electronic products,but“NOT”to sell any electronics.

If you are interested in our manufacturing service, please describe your product designs, applications, functions, PCB Assembly or Box-Build and annual expected quantities that you would like us to quote for you. Once we receive your requests, we will ask for more detailed technical information like BOM,Gerber,3D Drawing,Testing Info...etc for further RFQ evaluation.

Please follow these steps, they will definitely speed up your RFQ process way faster and more efficient.