Component Capabilities

Solder Paste Printing

SMT (BGA, uBGA, PoP and 01005)

BGA/CSP/CBGA/CCGA/PGA Down To 140 Micron Pitch

Soldering & Flip Chip with Die Size of 0.5~50mm

COB/COG/FOG/PoP

Multi-Chip, Chip On FPC

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